Design of experiment for improving wire bonding process of integrated circuit

Abstract

Using copper wire instead of gold wire can reduce a lot of cost in IC production of semiconductor industrial. However, the circuit stability (Circuit Reliability) is less than the use of goal wire. Therefore, the study to improve the production of integrated circuits in the part of the wire bonding process by increasing the baking process. It is an important process to improve the quality of the integrated circuit between Cu wire and chip. For this experimental study of baking process, it was performed by comparing IMC values at 175 ˚C and 200 ˚C. The quality of workpiece was tested and measured by Scanning Electron Microscope (SEM) machine every 30 minutes. The research experiment found that the temperature with effect to the workpiece quality to stabilize the IMC value was 175 ˚C for 9 hours nevertheless the new temperature at 200 ˚C, it has been applied with only 3 hours. Finally, the IMC testing result is higher than the average of the at 60% standard acceptable level as other research reviews and it also higher than the acceptable level of the industry level at 80%. Hence, this result can reduce time, cost of IC and workpieces production and it also including the higher quality of the products.